Hanmi Semiconductor Co. Opens New Factory to Boost Dual TC Bonder Production

South Korean chip equipment company Hanmi Semiconductor Co. announced the opening of a new factory to increase the production of dual TC bonders. These bonders are essential process equipment needed for the manufacturing of high bandwidth memory (HBM) used in artificial intelligence (AI) semiconductors.

HBM is a specialized next-generation memory semiconductor designed for high-performance AI operations. To produce HBM, a dual TC bonder is required. This equipment can attach multiple DRAMs using a thermal compression method. Hanmi Semiconductor has been developing and manufacturing this equipment since 2016, and it has now become their main business focus.

The new factory, located in Incheon City, utilizes the third out of five factories owned by Hanmi Semiconductor. With a total area of over 20,000 square meters, the third factory was originally used for assembling and testing the company’s equipment. However, it has now been transformed into a factory dedicated to the production of dual TC bonders and other TC bonders.

The third factory features a large clean room capable of assembling and testing about 50 semiconductor equipment simultaneously. This provides an optimized environment for the production of Dual TC Bonders, according to a Hanmi Semiconductor source.

With the opening of this new factory, Hanmi Semiconductor aims to meet the increasing demand for dual TC bonder equipment in the market. As the demand for AI semiconductors continues to grow, this expansion will help ensure a steady supply of vital components for the industry.